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Titlebook: Ultra Low-Power Electronics and Design; Enrico Macii Book 2004 Springer Science+Business Media New York 2004 Embedded Systems.architecture

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樓主: 啞劇表演
21#
發(fā)表于 2025-3-25 07:15:46 | 只看該作者
Ultra-Low-Power Design: Device and Logic Design Approaches, major causes of power consumption. Then we report on experiments in an advanced process technology with ultra-low threshold voltage (V.) devices. It turns out that in contrast to older process technologies, this approach increasingly is becoming less suitable for industrial usage in advanced proces
22#
發(fā)表于 2025-3-25 10:39:17 | 只看該作者
On-Chip Optical Interconnect for Low-Power,nect. Extrapolating this trend leads to a red brick wall which only radically different interconnect architectures and/or technologies will be able to overcome. The aim of this chapter is to explain how, by exploiting recent advances in integrated optical devices, optical interconnect within systems
23#
發(fā)表于 2025-3-25 14:26:19 | 只看該作者
24#
發(fā)表于 2025-3-25 18:19:18 | 只看該作者
Static Leakage Reduction through Simulteneous VTT/TOX and State Assignment,e propose new leakage current reduction methods in standby mode. First, we propose a combined approach of sleep-state assignment and threshold voltage (.) assignment in a dual-. process for subthreshold leakage (.) reduction. Second, for the minimization of gate oxide leakage current (.) which has b
25#
發(fā)表于 2025-3-25 22:27:14 | 只看該作者
Energy-Efficient Shared Memory Architectures for Multi-Processor Systems-On-Chip,r storage of shared data, is a significant performance bottleneck because it requires explicit synchronization of memory accesses which can potentially occur in parallel. Multi-port memories are a widely-used solution to this problem; they allow these potentially parallel accesses to occur simultane
26#
發(fā)表于 2025-3-26 00:47:18 | 只看該作者
27#
發(fā)表于 2025-3-26 04:17:32 | 只看該作者
28#
發(fā)表于 2025-3-26 12:07:48 | 只看該作者
Architectures and Design Techniques for Energy Efficient Embedded DSP and Multimedia Processing,any dedicated busses and interconnect options. The trend to merge multiple functions into one device makes the design and integration of these “systems-on-chip” (SOC’s) even more challenging. Yet, specifications and applications are never fixed and require the embedded units to be programmable. The
29#
發(fā)表于 2025-3-26 15:38:52 | 只看該作者
30#
發(fā)表于 2025-3-26 16:57:51 | 只看該作者
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