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Titlebook: Supramolecular Assembly via Hydrogen Bonds II; D. Michael P. Mingos Book 2004 Springer-Verlag Berlin Heidelberg 2004 Hydrogen Bonds.Materi

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書目名稱Supramolecular Assembly via Hydrogen Bonds II
編輯D. Michael P. Mingos
視頻videohttp://file.papertrans.cn/883/882194/882194.mp4
概述This series presents critical reviews of the present position and future trends in modern chemical research.Short and concise reports on chemistry, each written by the world‘s renowned experts.Still v
叢書名稱Structure and Bonding
圖書封面Titlebook: Supramolecular Assembly via Hydrogen Bonds II;  D. Michael P. Mingos Book 2004 Springer-Verlag Berlin Heidelberg 2004 Hydrogen Bonds.Materi
出版日期Book 2004
關(guān)鍵詞Hydrogen Bonds; Materials Science; bonding; inorganic chemistry; physical chemistry; structure
版次1
doihttps://doi.org/10.1007/b13961
isbn_softcover978-3-642-05752-6
isbn_ebook978-3-540-39806-6Series ISSN 0081-5993 Series E-ISSN 1616-8550
issn_series 0081-5993
copyrightSpringer-Verlag Berlin Heidelberg 2004
The information of publication is updating

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Hydrogen Bonding Interactions Between Ions: A Powerful Tool in Molecular Crystal Engineering,th respect to hydrogen bonds between neutral molecules the hydrogen bonding interactions between ions (inter-ionic hydrogen bonds) respond to additional energetic and topological constrains that depend on the convolution of the proton donor- proton acceptor interactions with the Coulombic field gene
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Hydrogen Bonded Network Structures Constructed from Molecular Hosts,talline materials that show multiple inclusion behaviour such as lattice inclusion and site specific host-guest interactions. Furthermore a number of hitherto elusive species have been isolated as components of such networks.
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Peter Hubberstey,Unchuleee Suksangpanya storage modes. No burning safety-related issue emerged from the twenty-two papers presented; however, the lack of wet storage space at most reactors and concerns regarding possible sabotage remain as issues that need to be periodically addressed. .978-1-4020-5902-5978-1-4020-5903-2Series ISSN 1871-4668 Series E-ISSN 1871-4692
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