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Titlebook: SOC (System-on-a-Chip) Testing for Plug and Play Test Automation; Krishnendu Chakrabarty Book 2002 Springer Science+Business Media New Yor

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樓主: Spring
11#
發(fā)表于 2025-3-23 12:41:26 | 只看該作者
Book 2002 efficient system integration. Test development is seen as a major bottleneck in SOC design and manufacturing capabilities. Testing SOCs is especially challenging in the absence of standardized test structures, test automation tools, and test protocols. In addition, long interconnects, high density,
12#
發(fā)表于 2025-3-23 13:58:01 | 只看該作者
13#
發(fā)表于 2025-3-23 18:26:28 | 只看該作者
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發(fā)表于 2025-3-24 00:37:29 | 只看該作者
15#
發(fā)表于 2025-3-24 04:50:55 | 只看該作者
On IEEE P1500’s Standard for Embedded Core Testwith respect to the test of core-based system chips, especially if they contain cores from different sources. This paper briefly describes IEEE P1500, and illustrates through a simplified example its scalable wrapper architecture, its test information transfer model described in a standardized Core Test Language, and its two compliance levels. ..
16#
發(fā)表于 2025-3-24 07:06:20 | 只看該作者
On IEEE P1500’s Standard for Embedded Core TestEE P1500 Standard for Embedded Core Test (SECT) is a standardunder-development that aims at improving ease of reuse and facilitating interoperability with respect to the test of core-based system chips, especially if they contain cores from different sources. This paper briefly describes IEEE P1500,
17#
發(fā)表于 2025-3-24 10:59:37 | 只看該作者
18#
發(fā)表于 2025-3-24 14:57:45 | 只看該作者
19#
發(fā)表于 2025-3-24 20:21:22 | 只看該作者
A Novel Reconfigurable Wrapper for Testing of Embedded Core-Based SOCs and its Associated Schedulingpresented. The ECTSP can be stated as follows; given a chip with .. cores each having a test ..; where .. takes time ..(.., ..) to execute on a test access mechanism (TAM) of width .., and a constraint . on the number of top-level test pins; calculate the TAM assignment vector π and the schedule Σ f
20#
發(fā)表于 2025-3-25 02:46:24 | 只看該作者
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