Titlebook: Reliability of Microtechnology; Interconnects, Devic Johan Liu,Olli Salmela,Cristina Andersson Book 2011 Springer Science+Business Media, L

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978-1-4899-8211-7Springer Science+Business Media, LLC 2011

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Book 2011ems. The book‘s focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and sy

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Gabriele Siegert,Dieter Brecheisit movement and mechanical activities, and protect soft tissues against traumatic forces, but also on account of their role in mineral homeostasis. For this reason, extensive investigation in the last 30 years has provided much to explain the complex chemical and physical processes occurring in cell

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