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Titlebook: Positron Profilometry; Probing Material Dep Jerzy Dryzek Book 2023 The Editor(s) (if applicable) and The Author(s), under exclusive license

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書目名稱Positron Profilometry
副標題Probing Material Dep
編輯Jerzy Dryzek
視頻videohttp://file.papertrans.cn/752/751927/751927.mp4
概述Features comprehensive coverage of positron profilometry, unraveling defect depth distribution in various materials.Gives an in-depth analysis of positron annihilation techniques and different implant
叢書名稱SpringerBriefs in Materials
圖書封面Titlebook: Positron Profilometry; Probing Material Dep Jerzy Dryzek Book 2023 The Editor(s) (if applicable) and The Author(s), under exclusive license
描述This book provides a comprehensive overview of positron profilometry, specifically focusing on the analysis of defect depth distribution in materials. Positron profilometry plays a crucial role in understanding and characterizing defects in a wide range of materials, including metals, semiconductors, polymers, and ceramics. By analyzing the depth distribution of defects, researchers can gain insights into various material properties, such as crystal structure, defect density, and diffusion behavior. The author‘s extensive research spanning a period of two decades has primarily centered on subsurface zones. These regions, located beneath the surface and subjected to various surface processes, play a crucial role in generating defect distributions. Three experimental techniques and their data analysis are described in detail: a variable-energy positron beam (VEP) called sometimes a slow positron beam, a technique called implantation profile depth scanning (DSIP), and a sequential etching(SET) technique. The usability of these techniques is illustrated by many examples of measurements by the author and others.
出版日期Book 2023
關(guān)鍵詞Defects Depth Distribution; Positron Annihilation Spectroscopy; Energetic Positrons in Matter; Material
版次1
doihttps://doi.org/10.1007/978-3-031-41093-2
isbn_softcover978-3-031-41092-5
isbn_ebook978-3-031-41093-2Series ISSN 2192-1091 Series E-ISSN 2192-1105
issn_series 2192-1091
copyrightThe Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Switzerl
The information of publication is updating

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