| 書目名稱 | Packaging of High Power Semiconductor Lasers |
| 編輯 | Xingsheng Liu,Wei Zhao,Hui Liu |
| 視頻video | http://file.papertrans.cn/741/740396/740396.mp4 |
| 概述 | Describes packaging design for high power semiconductor lasers.Details prevention techniques for thermal stress failures.Discusses most recent technology trends in semiconductor laser packaging |
| 叢書名稱 | Micro- and Opto-Electronic Materials, Structures, and Systems |
| 圖書封面 |  |
| 描述 | This book introduces high power semiconductor laser packaging design.?The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail. |
| 出版日期 | Book 2015 |
| 關(guān)鍵詞 | Fiber Lasers; High Power Semiconductor Lasers; Semiconductor Laser Components; Semiconductor Laser Pack |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-1-4614-9263-4 |
| isbn_softcover | 978-1-4939-5590-9 |
| isbn_ebook | 978-1-4614-9263-4Series ISSN 2626-2371 Series E-ISSN 2626-238X |
| issn_series | 2626-2371 |
| copyright | Springer Science+Business Media New York 2015 |
|Archiver|手機(jī)版|小黑屋|
派博傳思國際
( 京公網(wǎng)安備110108008328)
GMT+8, 2025-10-13 09:36
發(fā)表于 2025-3-21 17:38:06
