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Titlebook: Numerical Analysis of Heat and Mass Transfer in Porous Media; J.M.P.Q. Delgado,Antonio Gilson Barbosa Lima,Marta Book 2012 Springer-Verlag

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31#
發(fā)表于 2025-3-26 21:01:59 | 只看該作者
32#
發(fā)表于 2025-3-27 03:18:49 | 只看該作者
Contaminant Transport in Partially Saturated Porous Media,Our numerical solution is based on an implicit time and space discretization. The convergence of our numerical solution to the weak solution of the original problem is discussed. Finally, we demonstrate in our numerical experiments and comparisons with the benchmark solution (in 1D) the effectiveness of our method.
33#
發(fā)表于 2025-3-27 07:41:16 | 只看該作者
34#
發(fā)表于 2025-3-27 12:11:18 | 只看該作者
35#
發(fā)表于 2025-3-27 16:52:39 | 只看該作者
36#
發(fā)表于 2025-3-27 19:30:53 | 只看該作者
Alexander Tarasenko,Lubomir Jastrabíkis technology is, why it is beneficial, how it changes conveThree-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space
37#
發(fā)表于 2025-3-27 23:50:37 | 只看該作者
38#
發(fā)表于 2025-3-28 03:58:14 | 只看該作者
Felipe Ferreira Luz,Sandro Campos Amico,Jeferson ávila Souza,Enivaldo Santos Barbosa,Antonio Gilson is technology is, why it is beneficial, how it changes conveThree-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space
39#
發(fā)表于 2025-3-28 08:20:55 | 只看該作者
40#
發(fā)表于 2025-3-28 14:18:19 | 只看該作者
P. Kumar,F. Topin,M. Miscevic,P. Lavieille,L. Tadristis technology is, why it is beneficial, how it changes conveThree-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space
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