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Titlebook: New Aspects of Magellanic Cloud Research; Proceedings of the S Bodo Baschek,Gerhard Klare,James Lequeux Conference proceedings 1993 Springe

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樓主: 戲弄
51#
發(fā)表于 2025-3-30 10:06:23 | 只看該作者
52#
發(fā)表于 2025-3-30 15:18:17 | 只看該作者
Theodor Schmidt-Kaler, is proposed. The method uses algebraic normal forms, as applied to random binary vectors called super-symptoms for adaptation in the statistical analysis of biomedical applications. Usually the task was to consider all super-symptoms and to find a super-symptom with the best extreme properties by
53#
發(fā)表于 2025-3-30 17:02:47 | 只看該作者
54#
發(fā)表于 2025-3-30 23:56:35 | 只看該作者
55#
發(fā)表于 2025-3-31 04:55:41 | 只看該作者
F. P. Israel,P. R. Maloneyre often implemented using replication-based methods, such as the permutation test or bootstrap procedure. While such methods are widely applicable, they place a practical limit on the computational complexity of the underlying test procedure. In such cases it would seem natural to apply sequential
56#
發(fā)表于 2025-3-31 05:56:50 | 只看該作者
L. Vigrouxf circuit performance. For this reason, statisticaltechniques are required to design integrated circuits with maximumyield..Statistical Modeling for Computer-Aided Design of MOS VLSICircuits. describes a statistical circuit simulation andoptimization environment for VLSI circuit designers. The first
57#
發(fā)表于 2025-3-31 09:21:07 | 只看該作者
K. Okumura,F. Viallefond,M. Viton,W. Ricef circuit performance. For this reason, statisticaltechniques are required to design integrated circuits with maximumyield..Statistical Modeling for Computer-Aided Design of MOS VLSICircuits. describes a statistical circuit simulation andoptimization environment for VLSI circuit designers. The first
58#
發(fā)表于 2025-3-31 16:08:45 | 只看該作者
Stephen C. Russelldually become a hot topic in reliability engineering, which has been investigated extensively in the recent two decades. Various degradation models have been introduced to facilitate the reliability modeling and assessment of modern products, especially for highly reliable products. As the continual
59#
發(fā)表于 2025-3-31 21:01:02 | 只看該作者
Wolfgang Pietsch,Peter Kahabkaapplications, the accelerating variable is temperature. In such cases, a thermal index (TI) is used to indicate the strength of the material. For example, a TI of 200?.C may be interpreted as the material can be expected to maintain a specific property at a temperature of 200?.C for 100,000?h. A mat
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