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Titlebook: Network-on-Chip Security and Privacy; Prabhat Mishra,Subodha Charles Book 2021 The Editor(s) (if applicable) and The Author(s), under excl

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21#
發(fā)表于 2025-3-25 07:18:47 | 只看該作者
22#
發(fā)表于 2025-3-25 08:42:59 | 只看該作者
23#
發(fā)表于 2025-3-25 12:28:52 | 只看該作者
24#
發(fā)表于 2025-3-25 16:10:06 | 只看該作者
Trustworthy System-on-Chip Design Using Secure on-Chip Communication Architectures in complex SoCs. This chapter provides an overview of NoC-based SoC design methodology. It also introduces the security vulnerabilities in electrical, optical as well as wireless NoCs. Specifically, it presents five classes of attacks to motivate the need for developing lightweight countermeasures to secure on-chip communication architectures.
25#
發(fā)表于 2025-3-25 20:17:44 | 只看該作者
Design of Reliable NoC Architectures to meet the communication requirements of a System-on-Chip (SoC). This chapter investigates the factors affecting the reliability of an NoC architecture and presents efficient design paradigms to meet the reliability challenges.
26#
發(fā)表于 2025-3-26 00:38:28 | 只看該作者
eaders will gain a clear understanding of the existing security solutions for on-chip communication architectures and how they can be utilized effectively to design secure and trustworthy systems.?.978-3-030-69133-2978-3-030-69131-8
27#
發(fā)表于 2025-3-26 04:41:53 | 只看該作者
28#
發(fā)表于 2025-3-26 10:32:05 | 只看該作者
Trustworthy System-on-Chip Design Using Secure on-Chip Communication Architectures complex supercomputers. Cars are full of them, as are airplanes, satellites, and advanced military and medical devices. As applications grow increasingly complex, so do the complexities of the SoCs. Network-on-Chip (NoC) is a widely used solution for on-chip communication between various components
29#
發(fā)表于 2025-3-26 13:28:52 | 只看該作者
Interconnect Modeling for Homogeneous and Heterogeneous Multiprocessorsre CPUs, GPUs, and other accelerators) integrated with an interconnection system. The high-demand for increase in the number of cores has led to a need for greater integration of units across a chip. Thus, the need for a scalable and high-bandwidth communication fabric to connect the units has becom
30#
發(fā)表于 2025-3-26 17:18:15 | 只看該作者
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