| 書目名稱 | Modeling and Application of Flexible Electronics Packaging |
| 編輯 | YongAn Huang,Zhouping Yin,Xiaodong Wan |
| 視頻video | http://file.papertrans.cn/637/636090/636090.mp4 |
| 概述 | Is the first book available on modeling and applications of transfer printing of flexible electronics.Includes multiple processes developed according to the geometric shape of chips and devices.Offers |
| 圖書封面 |  |
| 描述 | .This book systematically discusses the modeling and application of?transfer manipulation?for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the?equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of?microelectronics. . |
| 出版日期 | Book 2019 |
| 關鍵詞 | Flexible electronics; Electronic packaging; Transfer printing; Laser-assisted transfer; Picking-up and p |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-981-13-3627-0 |
| isbn_ebook | 978-981-13-3627-0 |
| copyright | Science Press and Springer Nature Singapore Pte Ltd. 2019 |
|Archiver|手機版|小黑屋|
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