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Titlebook: Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering; Zhiguang Cheng,Norio Takahashi,Behzad Forghani Bo

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書目名稱Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering
編輯Zhiguang Cheng,Norio Takahashi,Behzad Forghani
視頻videohttp://file.papertrans.cn/637/636089/636089.mp4
概述Presents the work of an international team over 15 years.Includes research results presented as invited talks at international conferences.Focuses on engineering-oriented electromagnetic and thermal f
圖書封面Titlebook: Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering;  Zhiguang Cheng,Norio Takahashi,Behzad Forghani Bo
描述Co-authored by an international research group with a long-standing cooperation, this book focuses on engineering-oriented electromagnetic and thermal field modeling and application. It presents important contributions, including advanced and efficient finite element analysis used in the solution of electromagnetic and thermal field problems for large and multi-scale engineering applications involving application script development; magnetic measurement of both magnetic materials and components under various, even extreme conditions, based on well-established (standard and non-standard) experimental systems; and multi-level validation based on both industrial test systems and extended TEAM P21 benchmarking platform. Although these are challenging topics, they are useful for readers from both academia and industry.
出版日期Book 2020
關鍵詞Electromagnetic and thermal field; measurement of material properties; modeling and simulation; benchma
版次1
doihttps://doi.org/10.1007/978-981-15-0173-9
isbn_softcover978-981-15-0175-3
isbn_ebook978-981-15-0173-9
copyrightScience Press, Beijing and Springer Nature Singapore Pte Ltd. 2020
The information of publication is updating

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ocuses on engineering-oriented electromagnetic and thermal fCo-authored by an international research group with a long-standing cooperation, this book focuses on engineering-oriented electromagnetic and thermal field modeling and application. It presents important contributions, including advanced a
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Book 2020mental systems; and multi-level validation based on both industrial test systems and extended TEAM P21 benchmarking platform. Although these are challenging topics, they are useful for readers from both academia and industry.
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