Titlebook: Mein erster Dienst - An?sthesie; Tobias Fink,Daniel Kiefer Book 2022Latest edition Der/die Herausgeber bzw. der/die Autor(en), exklusiv li

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Tobias Fink,Daniel Kiefervides the reader with a fundamental understanding of the evo.Power Electronic Packaging .presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systemat

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Tobias Fink,Daniel Kiefervides the reader with a fundamental understanding of the evo.Power Electronic Packaging .presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systemat

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Tobias Fink,Daniel Kiefervides the reader with a fundamental understanding of the evo.Power Electronic Packaging .presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systemat

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Tobias Fink,Daniel Kieferrastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so?readers can clearly understand each task‘s unique characteristics. Power electro

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Tobias Fink,Daniel Kieferrastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so?readers can clearly understand each task‘s unique characteristics. Power electro

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