Titlebook: Lead-Free Electronic Solders; A Special Issue of t K. N. Subramanian Book 2007 Springer-Verlag US 2007 Hardware.development.electronics.lea

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Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints underycle of temperature excursion, and the cumulative effects of the same under repeated thermal cycling. Extent of such field influence, and the resultant damage, will also be significantly affected by the constraints imposed by the solder joint geometry. Any realistic evaluation of the solder joint be

飛鏢

Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plevolution for Pb-free solder joints with Cu and Ni under-bump-metallizations (UBMs). The EM lifetime was found to depend on the failure criterion used, so the results were compared based on the first resistance jump and conventional open-failure criterion. Solder joints with Cu UBM had a longer life

Limerick

Electromigration issues in lead-free solder joints,itch packaging as the diameter of the solder bump continues decreasing and the current that each bump carries keeps rising owing to higher performance requirement of electronic devices. As stated in 2003 International Technology Roadmap for Semiconductors (ITRS), the EM is expected to be the limitin

劇本

Stress analysis of spontaneous Sn whisker growth,ed for the growth, and the compressive stress is generated within, from the chemical reaction between Sn and Cu to form the intermetallic compound Cu.Sn. at room temperature. To obtain the compressive stress gradient, a break of the protective oxide on the Sn surface is required because the free sur

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節(jié)約

978-1-4419-4302-6Springer-Verlag US 2007

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激怒

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