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Titlebook: Laser-Assisted Microtechnology; Simeon M. Metev,Vadim P. Veiko Book 19941st edition Springer-Verlag Berlin Heidelberg 1994 Laser Microtech

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樓主: 根深蒂固
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發(fā)表于 2025-3-25 05:25:43 | 只看該作者
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發(fā)表于 2025-3-25 10:13:59 | 只看該作者
Simeon M. Metev,Vadim P. Veikowide.Shows the sample preparation method for high-quality ul.In this thesis, the author has developed a high-resolution spin-resolved photoemission spectrometer that achieves the world-best energy resolution of 8 meV. The author has designed a new, highly efficient mini Mott detector that has a larg
23#
發(fā)表于 2025-3-25 13:13:20 | 只看該作者
Simeon M. Metev,Vadim P. Veikowide.Shows the sample preparation method for high-quality ul.In this thesis, the author has developed a high-resolution spin-resolved photoemission spectrometer that achieves the world-best energy resolution of 8 meV. The author has designed a new, highly efficient mini Mott detector that has a larg
24#
發(fā)表于 2025-3-25 18:58:03 | 只看該作者
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發(fā)表于 2025-3-25 20:24:18 | 只看該作者
er band pass of energy, and various recording units to detect the x-rays. In this chapter we deal with the experimental arrangement as a whole. There are general aspects to consider in setting-up an x-ray experiment: The sample is illuminated by an incident beam striking the sample surface under a d
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發(fā)表于 2025-3-26 00:55:15 | 只看該作者
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發(fā)表于 2025-3-26 08:21:44 | 只看該作者
Laser Micromachining of Thin Films,atment is that laser radiation be concentrated into a zone of strictly determined shape and boundaries. This can be satisfied by two principal conditions: the use of pulsed-laser radiation and of a projection-optical set-up for the formation of the zone of interaction.
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發(fā)表于 2025-3-26 12:00:04 | 只看該作者
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發(fā)表于 2025-3-26 14:46:48 | 只看該作者
0933-033X e monograph describes fundamental aspects and practical details of the technological processes as well as the optimum conditions for their realization.978-3-642-97327-7Series ISSN 0933-033X Series E-ISSN 2196-2812
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發(fā)表于 2025-3-26 17:38:11 | 只看該作者
Laser Microshaping,ities and often require more accurate beam focusing than is the case for laser welding and heat treating. The technological processing of materials connected with alteration of their dimensions and shapes is usually referred to as material shaping.
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