Titlebook: Laser Processing and Chemistry; Dieter B?uerle Book 20003rd edition Springer-Verlag Berlin Heidelberg 2000 Helium-Atom-Streuung.Laser.Lase

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書目名稱Laser Processing and Chemistry影響因子(影響力)




書目名稱Laser Processing and Chemistry影響因子(影響力)學(xué)科排名




書目名稱Laser Processing and Chemistry網(wǎng)絡(luò)公開度




書目名稱Laser Processing and Chemistry網(wǎng)絡(luò)公開度學(xué)科排名




書目名稱Laser Processing and Chemistry被引頻次




書目名稱Laser Processing and Chemistry被引頻次學(xué)科排名




書目名稱Laser Processing and Chemistry年度引用




書目名稱Laser Processing and Chemistry年度引用學(xué)科排名




書目名稱Laser Processing and Chemistry讀者反饋




書目名稱Laser Processing and Chemistry讀者反饋學(xué)科排名

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Thermal, Photophysical, and Photochemical Processeseen laser light and matter, and of the various relaxation times involved. This information is available only for a few special systems. For this reason, the definitions usually employed are not very strict. We shall consider a laser-induced process as thermally activated if the thermalization of the

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Nucleation and Cluster Formationesis of powders, laser-CVD, pulsed-laser deposition (PLD) etc. Of similar importance are (heterogeneous) nucleation processes in laser-annealing, recrystallization, thin-film formation, etc. Depending on the particular application, nucleation and cluster formation can be desirable or undesirable. An

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Preserve

Non-uniform Media with respect to those estimated for plane uniform (homogeneous) substrates. . changes in physical properties may be related to temperature dependences of material parameters or to slow changes in the material structure or composition. . changes in physical properties occur in some types of composit

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Surface Meltingfinement, glass formation, sealing of porous materials, alloying, some types of surface hardening, laser sintering, surface cladding, many types of engraving and marking, laser bending, laser welding, abrasive laser machining, some types of laser-chemical etching and deposition, and most types of la

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Nanosecond-Laser Ablationssisted evaporation and laser sputtering are also frequently used. Within the regime under consideration, material removal takes place far from equilibrium and may be based on thermal or non-thermal microscopic mechanisms. For this reason, we will prefer the term laser ablation, which is less sugges

Seizure

Ultrashort-Pulse Laser Ablationand wide-bandgap materials. Because both the influence of heat conduction within the material and screening of the incident laser light are strongly diminished with picosecond pulses, and can even be ignored with femtosecond pulses, material removal is very localized and requires less energy.

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