| 書(shū)目名稱(chēng) | Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology | | 編輯 | John H. Lau | | 視頻video | http://file.papertrans.cn/345/344340/344340.mp4 | | 概述 | Presents both in theory and practice.Comprehensive studies in design, materials, process, fabrication, and reliability of various technology.Provides in-depth treatment of a number of major topics in | | 圖書(shū)封面 |  | | 描述 | .This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics..The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.. | | 出版日期 | Book 2024 | | 關(guān)鍵詞 | Flip chip; Hybrid bonding; Fan-in wafer-level package; Fan-out wafer-level package; Hybrid substrate; Bri | | 版次 | 1 | | doi | https://doi.org/10.1007/978-981-97-2140-5 | | isbn_softcover | 978-981-97-2142-9 | | isbn_ebook | 978-981-97-2140-5 | | copyright | The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Singapor |
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書(shū)目名稱(chēng)Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology網(wǎng)絡(luò)公開(kāi)度學(xué)科排名
書(shū)目名稱(chēng)Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology被引頻次
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