Titlebook: Electronics Production Defects and Analysis; Oommen Tharakan Kuttiyil Thomas,Padma Padmanabhan Book 2022 The Editor(s) (if applicable) an

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Soldering Defects,efect have been discussed. The defect due to presence of flux residues has also been touched upon. The methods for mitigation/elimination of these defects have also been explained. A total of 45 live cases under 22 groups is presented.

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PCB Defects, defects on microsectioning of coupons of PCBs has been presented. This chapter illustrates the defects in PCBs through high-resolution photographic images. The methods for mitigation/elimination of these defects have also been explained. A total of 55 live cases under 18 groups are presented.

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Conformal Coating and Potting Defects,ed are illustrated. This includes entrapment of conformal coating material in undesired areas, splattering of material and missing coating. The method of inspection and acceptance criteria has been addressed. This chapter describes these defects through high-resolution photographic images.

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Defects Due to the Usage of Non-FFF Components,ailures, ?inadequate coalescence of solder joints, room for foreign object material deposit, etc. Thus, every effort shall be made to see that replacement is done only with form, fit and functionally equivalent components. A total of 7 such typical cases have been captured and illustrated through high resolution photographs.

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https://doi.org/10.1007/978-3-662-62444-9g, undesired shorting, deviations from established routing methods, etc. Multiple level of verification preferably three-tier is recommended to be implemented so that no errors are left unaddressed and resolved. Automated methods for verification of CAD layouts need to be explored.

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