Titlebook: Electromigration Modeling at Circuit Layout Level; Cher Ming Tan,Feifei He Book 2013 The Author(s) 2013 3D Modeling.Atomic Flux Divergence

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synovitis

GLOSS

3D Circuit Model Construction and Simulation,a method to construct a complete 3D circuit model is necessary and this chapter will illustrate the construction and the corresponding transient electro-thermo-structural simulations for the EM reliability assessment of an IC.

Fibroid

Rita D. Sherma (Director),Arvind Sharma(EM) reliability of ICs is becoming increasingly important. As re-design and re-manufacture are very time- and resource-consuming for present-day, ultra large-scale integration (ULSI), “Design-for-Reliability,” is essential.

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: The Film World as Representation EM models in literature use the line-via test structures which are only part of the real circuit structure. To further demonstrate the necessity for complete circuit modeling, the comparison of the EM performances in a circuit structure and a standard line-via test structure is performed in this ch

GIBE

M. A. Mohamed Salih,Bas Gaay de Fortmancuits consist of a large number of transistors and other circuit components connected by complex inter-block connections made of multiple metal layers. In this chapter, a complete 3D circuit model including both intra- and inter-block interconnects is constructed. Electro-thermo-structural simulatio

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Quantitative Brain SPECT in three Dimensionsrm. Studies using patient head CT (for the attenuation map), point-source measurement (for the resolution kernel), and the Hoffman brain phantom demonstrated accurate reconstruction by the enlarged uniform attenuation map (< 1% ROI error), as compared to the reconstruction using the true head attenuation map.