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Titlebook: Ductile Mode Cutting of Brittle Materials; Kui Liu,Hao Wang,Xinquan Zhang Book 2020 Springer Nature Singapore Pte Ltd. 2020 Silicon Ductil

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發(fā)表于 2025-3-21 17:03:41 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
書目名稱Ductile Mode Cutting of Brittle Materials
編輯Kui Liu,Hao Wang,Xinquan Zhang
視頻videohttp://file.papertrans.cn/284/283354/283354.mp4
概述Provides insights into the fundamental mechanism in ductile mode cutting of brittle materials such as silicon, glass, tungsten carbide, and calcium fluoride.Introduces advanced hybrid machining proces
叢書名稱Springer Series in Advanced Manufacturing
圖書封面Titlebook: Ductile Mode Cutting of Brittle Materials;  Kui Liu,Hao Wang,Xinquan Zhang Book 2020 Springer Nature Singapore Pte Ltd. 2020 Silicon Ductil
描述.This book provides a systematic and comprehensive interdisciplinary overview of ductile mode cutting of brittle materials, covering a range of topics from the fundamental physics to engineering practices. Discussing the machining mechanics and material properties, it explains the fundamental mechanism of ductile-to-brittle transition in the cutting of brittle materials. It also presents theoretical modeling and molecular dynamic simulation to demonstrate that ductile mode cutting can be achieved under certain conditions, as well as extensive experimental studies that produced smooth and damage-free surfaces on different materials, such as silicon, glass, tungsten carbide and calcium fluoride. Lastly, it explores how the ductile mode cutting performance and machinability of brittle materials can be further improved by hybrid machining processes like ultrasonic vibration and thermal-assisted cutting technologies in order to meet industry demands.?..?.
出版日期Book 2020
關(guān)鍵詞Silicon Ductile Cutting; Glass Ductile Cutting; Tungsten Carbide Ductile Cutting; Calcium Fluoride D
版次1
doihttps://doi.org/10.1007/978-981-32-9836-1
isbn_softcover978-981-32-9838-5
isbn_ebook978-981-32-9836-1Series ISSN 1860-5168 Series E-ISSN 2196-1735
issn_series 1860-5168
copyrightSpringer Nature Singapore Pte Ltd. 2020
The information of publication is updating

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https://doi.org/10.1007/978-3-031-36131-9In this book, ductile mode cutting of brittle material is presented and discussed systematically in terms of fundamentals, engineering applications and hybrid ductile mode cutting techniques, which is summarized as the following aspects.
地板
發(fā)表于 2025-3-22 05:42:38 | 只看該作者
SummaryIn this book, ductile mode cutting of brittle material is presented and discussed systematically in terms of fundamentals, engineering applications and hybrid ductile mode cutting techniques, which is summarized as the following aspects.
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Matthieu Viry,Marlène Villanova dislocation extension in the?chip formation zone are examined based on an analysis of cutting geometry and forces in the?cutting zone, both on Taylor’s dislocation hardening theory and strain gradient plasticity theory. Ductile chip formation is a result of large compressive stress and shear stress
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Xinye Shao,Mingchuan Yang,Qing Guorinding or/and abrasive process, which always generate micro cracks and subsurface damage. In this chapter, theoretical analysis on ductile mode cutting of silicon wafer shows that machined silicon surface with free of fracture and nanometer scale surface roughness can be achieved when dislocation d
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