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Titlebook: Diffusion Processes in Advanced Technological Materials; Devendra Gupta (Emeritus Research Staff Member) Book 2005 Springer-Verlag Berlin

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21#
發(fā)表于 2025-3-25 06:30:35 | 只看該作者
Metal Diffusion in Polymers and on Polymer Surfaces, polymer glass transition, which can be depressed at the surface[., .] metal clusters are generally embedded in the polymer and, depending on their size and the polymer viscosity, may perform a Brownian motion.[., .]
22#
發(fā)表于 2025-3-25 08:51:28 | 只看該作者
Book 2005move. . . " But before I could finish this sentence, my 7-year-old grandson Vinnie interjected, "Grandpa, do atoms play soccer?" This book is about the games atoms play in diffusion and various other properties of materials. While diffusion has been studied for more than 100 years in solids, its imp
23#
發(fā)表于 2025-3-25 14:48:07 | 只看該作者
24#
發(fā)表于 2025-3-25 18:38:58 | 只看該作者
terials pack- ages is determined by diffusion, a highly interactive and synergic phe- nomenon that interrelates to the microstructure, the microchemistry, and the superimposed physical fields. While the various978-3-642-06019-9978-3-540-27470-4
25#
發(fā)表于 2025-3-25 21:58:33 | 只看該作者
Reference-dependent preferencesture, and the defect type and content), the temperature, and the surroundings of the materials in contact with each other. Such diffusion and mixing lead to changes in the properties of the materials, sometimes to a better material and other times to an undesirable material behavior.
26#
發(fā)表于 2025-3-26 02:33:02 | 只看該作者
27#
發(fā)表于 2025-3-26 07:59:13 | 只看該作者
References no. 21505-25161 / AAR-ZURffusion manifests itself in the fabrication of HTSC elements. In the bulk production of tapes and wires produced by the oxide-powder-in-tube (OPIT) method, for example, silver sheath is typically used and the composite is subjected to severe thermomechanical deformation.[.] In such a fabrication pro
28#
發(fā)表于 2025-3-26 12:25:06 | 只看該作者
29#
發(fā)表于 2025-3-26 16:15:35 | 只看該作者
Diffusion Processes in Advanced Technological Materials978-3-540-27470-4
30#
發(fā)表于 2025-3-26 19:23:33 | 只看該作者
Diffusion Barriers in Semiconductor Devices/Circuits,ture, and the defect type and content), the temperature, and the surroundings of the materials in contact with each other. Such diffusion and mixing lead to changes in the properties of the materials, sometimes to a better material and other times to an undesirable material behavior.
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