Titlebook: Die-stacking Architecture; Yuan Xie,Jishen Zhao Book 2015 Springer Nature Switzerland AG 2015

Prosaic

Psoriasis and Psoriatic Arthritisr 2D, the stacking of multiple active layers in 3D design leads to higher power densities than its 2D counterpart, exacerbating the thermal issue. Therefore, it is essential to conduct thermal-aware 3D IC designs. This chapter presents an overview of thermal modeling for 3D IC and outlines solution schemes to overcome the thermal challenges.

Clumsy

confederacy

978-3-031-00619-7Springer Nature Switzerland AG 2015

Herbivorous

Coarse-granularity 3D Processor Design,as caches or even on-chip main memories. Different from the research in the previous section, which focuses on optimizations in the fine-granularity (e.g., wire length reduction), the approaches of this section consider the memories as a whole structure and explore the high-level improvements, such as access interfaces, replacement policies, etc.

aplomb

3D Network-on-Chip,obal on-chip wiring, by using switching fabrics or routers to connect processor cores or processing elements (PEs). Typically, the PEs communicate with each other using a packet-switched protocol, as illustrated by Fig. 6.1.

HILAR

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cardiovascular

共同生活

Food Waste Composting in Seattle: The Political Perspectiveay as you throw) system. Trash disposal fee-based incentives, paired with a zero waste resolution and a participation mandate for single- and multi-family residences, have increased Seattle’s composting levels and helped the city achieve one of the highest per capita compostables collection rates in the nation.

Foregery