Titlebook: Design for Manufacturability; From 1D to 4D for 90 Artur Balasinski Book 2014 Springer Science+Business Media New York 2014 22nm technology

孵化

書目名稱Design for Manufacturability影響因子(影響力)




書目名稱Design for Manufacturability影響因子(影響力)學(xué)科排名




書目名稱Design for Manufacturability網(wǎng)絡(luò)公開度




書目名稱Design for Manufacturability網(wǎng)絡(luò)公開度學(xué)科排名




書目名稱Design for Manufacturability被引頻次




書目名稱Design for Manufacturability被引頻次學(xué)科排名




書目名稱Design for Manufacturability年度引用




書目名稱Design for Manufacturability年度引用學(xué)科排名




書目名稱Design for Manufacturability讀者反饋




書目名稱Design for Manufacturability讀者反饋學(xué)科排名

acolyte

Control-Group

HAWK

使苦惱

New DfM Domain: Stress Effects,th chip and package stack design, is required to span orders of magnitude of physical dimensions. It should not only comprehend the effects of mechanical stresses in electrical responses of the circuits, but also their reliability impact.

刺耳

Book 2014nd quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.

刺耳

調(diào)情

New DfM Domain: Stress Effects,pting to divide the sources of such stress into the intentional and non-intentional ones or intrinsic and extrinsic. However, a better distinction would be whether we are able to take advantage of them in product implementation (intrinsic) or are they outside the device model space (extrinsic). When

多節(jié)

https://doi.org/10.1007/978-1-4614-1761-322nm technology node DFM; 3D Design for manufacturability; DFM; Design for manufacturability; Integrated

galley