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Titlebook: Contactless VLSI Measurement and Testing Techniques; Selahattin Sayil Book 2018 Springer International Publishing AG 2018 Integrated Circu

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樓主: Suture
31#
發(fā)表于 2025-3-26 22:08:57 | 只看該作者
32#
發(fā)表于 2025-3-27 01:18:16 | 只看該作者
https://doi.org/10.1007/978-3-662-22587-5st industrially developed contactless testing technique. The photoemissive probe, on the other hand, uses a pulsed optical beam of a certain energy to probe a signal on a metal line of any substrate. The optical beam causes photoelectrons to be emitted from the top layer of a metal from which the waveform of the signal is derived.
33#
發(fā)表于 2025-3-27 05:39:44 | 只看該作者
Contactless Testing,ing and design verification, as well as for functional testing. After some introduction on contactless testing, this chapter focuses on the photoexcitation probe technique. This technique uses a focused laser beam to photoexcite carriers near an active device to detect logic levels of transistors.
34#
發(fā)表于 2025-3-27 13:02:19 | 只看該作者
35#
發(fā)表于 2025-3-27 16:46:37 | 只看該作者
Conventional Test Methods,l and internal fault testing face increasingly difficult challenges. This chapter discusses these limitations of conventional methods and highlights the importance of alternative probing solutions to address the upcoming challenges.
36#
發(fā)表于 2025-3-27 18:20:16 | 只看該作者
Testability Design,growing portion of a product’s total costs. DFT techniques are valuable methods for helping solve the growing test problem. The cost is the increased silicon circuit area to accommodate the hardware overhead and potentially reduced circuit performance.
37#
發(fā)表于 2025-3-27 22:42:23 | 只看該作者
38#
發(fā)表于 2025-3-28 02:52:47 | 只看該作者
39#
發(fā)表于 2025-3-28 09:44:04 | 只看該作者
40#
發(fā)表于 2025-3-28 13:00:50 | 只看該作者
https://doi.org/10.1007/978-3-662-24781-5ss testing methodologies that covered in this text and makes a comparison based on above properties. This will be valuable to readers as contactless probing is gaining more importance as fabrication technologies become smaller and more susceptible to the parasitic impact of mechanical probes.
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