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Titlebook: Compound Semiconductor Materials and Devices; Zhaojun Liu,Tongde Huang,Xinbo Zou Book 2016 Springer Nature Switzerland AG 2016

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書目名稱Compound Semiconductor Materials and Devices
編輯Zhaojun Liu,Tongde Huang,Xinbo Zou
視頻videohttp://file.papertrans.cn/232/231860/231860.mp4
叢書名稱Synthesis Lectures on Emerging Engineering Technologies
圖書封面Titlebook: Compound Semiconductor Materials and Devices;  Zhaojun Liu,Tongde Huang,Xinbo Zou Book 2016 Springer Nature Switzerland AG 2016
描述Ever since its invention in the 1980s, the compound semiconductor heterojunction-based high electron mobility transistor (HEMT) has been widely used in radio frequency (RF) applications. This book provides readers with broad coverage on techniques and new trends of HEMT, employing leading compound semiconductors, III-N and III-V materials. The content includes an overview of GaN HEMT device-scaling technologies and experimental research breakthroughs in fabricating various GaN MOSHEMT transistors. Readers are offered an inspiring example of monolithic integration of HEMT with LEDs, too. The authors compile the most relevant aspects of III-V HEMT, including the current status of state-of-art HEMTs, their possibility of replacing the Si CMOS transistor channel, and growth opportunities of III-V materials on an Si substrate. With detailed exploration and explanations, the book is a helpful source suitable for anyone learning about and working on compound semiconductor devices.
出版日期Book 2016
版次1
doihttps://doi.org/10.1007/978-3-031-02028-5
isbn_softcover978-3-031-00900-6
isbn_ebook978-3-031-02028-5Series ISSN 2381-1412 Series E-ISSN 2381-1439
issn_series 2381-1412
copyrightSpringer Nature Switzerland AG 2016
The information of publication is updating

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https://doi.org/10.1007/978-3-658-14688-7s presented and analyzed. To explore the potential of GaN HEMTs in RF power applications, device configuration elements are correlated with several key device performance parameters. Four device scaling technologies, namely, source/strain regrowth, (In)AlN barrier thinning, T-gate fabrication, and g
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978-3-031-00900-6Springer Nature Switzerland AG 2016
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