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Titlebook: Analysis and Simulation of Heterostructure Devices; Vassil Palankovski,Rüdiger Quay Book 2004 Springer-Verlag Wien 2004 HBTs.HEMTs.Heteroj

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發(fā)表于 2025-3-21 19:23:49 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
期刊全稱Analysis and Simulation of Heterostructure Devices
影響因子2023Vassil Palankovski,Rüdiger Quay
視頻videohttp://file.papertrans.cn/157/156264/156264.mp4
發(fā)行地址First full and comprehensive modeling of relevant compound semiconductors.Verified by precise simulation of real-state-of-the-art devices in over 25 different simulation examples.Bridges the gap betwe
學(xué)科分類Computational Microelectronics
圖書封面Titlebook: Analysis and Simulation of Heterostructure Devices;  Vassil Palankovski,Rüdiger Quay Book 2004 Springer-Verlag Wien 2004 HBTs.HEMTs.Heteroj
影響因子Communication and information systems are subject to rapid and highly so- phisticated changes. Currently semiconductor heterostructure devices, such as Heterojunction Bipolar Transistors (HBTs) and High Electron Mobility Transis- tors (HEMTs), are among the fastest and most advanced high-frequency devices. They satisfy the requirements for low power consumption, medium integration, low cost in large quantities, and high-speed operation capabilities in circuits. In the very high-frequency range, cut-off frequencies up to 500 GHz [557] have been reported on the device level. HEMTs and HBTs are very suitable for high- efficiency power amplifiers at 900 MHz as well as for data rates higher than 100 Gbitfs for long-range communication and thus cover a broad range of appli- cations. To cope with explosive development costs and the competition of today‘s semicon- ductor industry, Technology Computer-Aided Design (TCAD) methodologies are used extensively in development and production. As of 2003, III-V semiconductor HEMT and HBT micrometer and millimeter-wave integrated circuits (MICs and MMICs) are available on six-inch GaAs wafers. SiGe HBT circuits, as part of the CMOS technology on eig
Pindex Book 2004
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發(fā)表于 2025-3-21 22:53:10 | 只看該作者
State-of-the-Art of Materials, Device Modeling, and RF Devices,r geometric arrangement of their atoms in space and therefore cannot be easily studied. Crystalline solids have a perfect periodic arrangement of atoms, which allows them to be easily analyzed. Polycrystalline solids have atomic arrangements between these two extremes. Semiconductor materials are ne
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RF Parameter Extraction for HEMTs and HBTs,quencies, and, last but not least, small-signal equivalent circuit elements for various topologies. It further provides a view of the physical understanding of the bias dependence of small-signal equivalent circuit elements in HEMTs and HBTs in analytcial models and TCAD approaches.
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Introduction,n circuits. In the very high-frequency range, cut-off frequencies up to 500 GHz [557] have been reported on the device level. HEMTs and HBTs are verysuitable for high efficiency power amplifiers at 900 MHz as well as for data rates higher than 100 Gbit/sfor long-range communication and thus cover abroad rangeof applications.
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發(fā)表于 2025-3-22 20:44:44 | 只看該作者
State-of-the-Art of Materials, Device Modeling, and RF Devices,arly perfect crystalline solids with a small amount of imperfections, such as impurity atoms, lattice vacancies, or dislocations, which can be intentionally introduced to alter their electrical characteristics[305].
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0179-0307 over 25 different simulation examples.Bridges the gap betweCommunication and information systems are subject to rapid and highly so- phisticated changes. Currently semiconductor heterostructure devices, such as Heterojunction Bipolar Transistors (HBTs) and High Electron Mobility Transis- tors (HEMT
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發(fā)表于 2025-3-23 06:10:38 | 只看該作者
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