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Titlebook: Advanced Parallel Processing Technologies; 10th International S Chenggang Wu,Albert Cohen Conference proceedings 2013 Springer-Verlag Berli

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樓主: antithetic
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發(fā)表于 2025-3-25 04:46:28 | 只看該作者
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發(fā)表于 2025-3-25 10:35:39 | 只看該作者
Optimizing Program Performance via Similarity, Using a Feature-Agnostic Approach,tors, their applications and market penetration.Looking around, we see that products using vacuum tube technology are disappearing. For example, branch tube TVs have changed to liquid crystal TVs, and fluorescent light have turned into LED. The switch from vacuum tube technology to semiconductor tec
23#
發(fā)表于 2025-3-25 15:26:35 | 只看該作者
Scalable NIC Architecture to Support Offloading of Large Scale MPI Barrier,mobile systems are built.Coverage of superheterodyne, direct.RF System Design of Transceivers for Wireless Communications is for RF Engineers and, in particular, those engineers focusing mostly on RF systems and RFIC design. The author develops systematic methods for RF systems design, complete with
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發(fā)表于 2025-3-25 18:17:19 | 只看該作者
An Efficient Parallel Mechanism for Highly-Debuggable Multicore Simulator,ons. The packages are constructed using multi-layer LCP films and are surface mounted on a printed circuit board (PCB). Packages include a typical low pass feedthrough design, as well as a new bandpass feedthrough design. Our experimental results demonstrate that the low pass package feedthrough tra
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發(fā)表于 2025-3-25 22:41:30 | 只看該作者
Data Access Type Aware Replacement Policy for Cache Clustering Organization of Chip Multiprocessors Further advance in scaling down below current 10nm is very challenging and almost approaching theoretical limit. For example, electrical resistivity of copper interconnects increases with the shrinkage of dimension due to grain-boundary and surface scattering. Electromigration and hot spot of metal
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