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Titlebook: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering; Wafer-Level Transfer Seonho Seok Book 2018 Springer Internat

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發(fā)表于 2025-3-21 20:07:48 | 只看該作者 |倒序瀏覽 |閱讀模式
期刊全稱Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
期刊簡稱Wafer-Level Transfer
影響因子2023Seonho Seok
視頻videohttp://file.papertrans.cn/147/146080/146080.mp4
發(fā)行地址Introduces a new and unique packaging technology.Explains microelectromechanical systems (MEMS) packaging utilizing polymers or thin films.Discusses finite element method (FEM) modeling to explain the
學(xué)科分類Springer Series in Advanced Manufacturing
圖書封面Titlebook: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering; Wafer-Level Transfer Seonho Seok Book 2018 Springer Internat
影響因子.This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure..Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap.
Pindex Book 2018
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Introduction to Biomedical Ethics,er will explain the way how to establish an appropriate FEM model to simulate the debonding process occurring in the interface between Si carrier wafer and transferred cap. The modeling will be useful to comprehend the behavior of the transferred cap in terms of deformation and stress during the debonding process.
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Overview of MEMS Packaging Technologies,ile life of bacteria poses a different problem in human life. Chronic infection, contamination in food industries and biofouling in industrial materials are serious challenges which need to overcome. It is imperative to understand the bacterial adhesion and subsequent biofilm development to study bi
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Polymer Cap Transfer Packaging Technologies, poor quality income with which to pay the debt. This creates a condition of “fracture criticality” for the company, a condition where a small negative occurrence can trigger collapse of the enterprise for lack of resiliency. Too much debt and too little reliable income creates the potential fractur
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