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Titlebook: Wafer Scale Integration; Earl E. Swartzlander Book 1989 Kluwer Academic Publishers 1989 Programmable Logic.Signal.Software.VLSI.Wafer.comp

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樓主: bradycardia
61#
發(fā)表于 2025-4-1 05:54:46 | 只看該作者
Wafer-Scale Testing/Design for Testability,ies. As digital systems become more complex, they are characterized by more internal circuitry per I/O line and larger internal state spaces. This makes testing complex systems as integrated units very difficult. The testing problem can be made more tractable by partitioning them into subsystems tha
62#
發(fā)表于 2025-4-1 06:28:50 | 只看該作者
63#
發(fā)表于 2025-4-1 11:24:32 | 只看該作者
64#
發(fā)表于 2025-4-1 16:59:04 | 只看該作者
The 3-D Computer: An Integrated Stack of WSI Wafers,pany higher levels of integration have been the driving constraints. In virtually all instances, though, the end goal has been the same: increase the packaging density of the active electronic elements.
65#
發(fā)表于 2025-4-1 19:15:33 | 只看該作者
66#
發(fā)表于 2025-4-2 01:15:12 | 只看該作者
afer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells ar
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