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Titlebook: Wafer Scale Integration; Earl E. Swartzlander Book 1989 Kluwer Academic Publishers 1989 Programmable Logic.Signal.Software.VLSI.Wafer.comp

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發(fā)表于 2025-3-23 11:23:33 | 只看該作者
R. Wayne Johnson,Richard C. Jaeger,Travis N. Blalocke of electronics in the design and construction of certain automobile parts. Examples of these are the use of transistors, diodes and printed circuits on flat and flexible bases, notably for instrument panels, while minia- turized versions of printed circuits are finding wider applications in automobile compo978-94-011-6883-0978-94-011-6881-6
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High Yield In-Situ Fabrication of Multilevel Interconnections for WSI,f in-situ processing is the elimination entirely of the use of liquids in wet processing steps, the introduction of all deposition and etching reactants as gases or vapors in ultra clean vessels, and the use of extreme chemical purity. Often this implies the use of low level or even ultra high vacuu
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Book 1989n to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuit
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test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuit978-1-4612-8896-1978-1-4613-1621-3
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